Recently bought a new DSC-TX10 black. Taken on holiday and came back to realise (after taking out memory card) that there are chunks missing from the outer casing around the LCD screen.
There has been no drops higher than 10cm since it has arrived, yet these cracks and chunks missing exist.
Apparently the TX10 is MIL-STD 810F Method 516.5 Shock certified. This means it can be dropped upwards of 26 times from a height of 48 in or less without suffering any structural damage (see http://www.dtc.army.mil/publications/810.pdf section 516.5-1).
Now, will this be covered under Sony's 1Y warranty as this physical damage (not normally covered under warranty) but is EXPLICITLY DESIGNED TO RESIST THIS....??
If Sony uses these tests explicitly done as the tests are designed (in the link) then this should be covered under warranty as it obviously doesnt meet Sony's description? Otherwise if Sony have adapted the tests to their own standards then can anyone describe these? And if yes on the latter, then surely they should not be MIL-STD 810F Method 516.5 Shock certified??